{"product_id":"2019-koh-young-ky8030-3-xl-3d-solder-paste-inspection-spi-system","title":"2019 Koh Young KY8030-3 XL 3D Solder Paste Inspection (SPI) System","description":"\u003cp\u003e\u003cstrong\u003eLarge PCB 3D Solder Paste Inspection System\u003c\/strong\u003e\u003cbr\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eActual machine photos and operating video coming soon!\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp data-start=\"169\" data-end=\"681\" class=\"PDq2pG_selectionAnchorContainer\"\u003eThe \u003cstrong data-start=\"173\" data-end=\"203\"\u003e2019 Koh Young KY8030-3 XL\u003c\/strong\u003e is a high-precision \u003cstrong data-start=\"224\" data-end=\"260\"\u003e3D Solder Paste Inspection (SPI)\u003c\/strong\u003e system designed for electronics manufacturers requiring accurate solder paste measurement on larger PCB assemblies. Powered by Koh Young's proven \u003cstrong data-start=\"407\" data-end=\"441\"\u003eTrue 3D measurement technology\u003c\/strong\u003e, the XL configuration provides precise inspection of solder paste volume, height, area, and shape, helping improve print quality, reduce defects, and maximize SMT production yield across high-mix and high-volume manufacturing environments. \u003cspan aria-hidden=\"true\" class=\"PDq2pG_selectionAnchor\"\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp data-section-id=\"1j5qwet\" data-start=\"688\" data-end=\"707\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"691\" data-end=\"707\"\u003eKey Features\u003cbr\u003e\u003c\/strong\u003e\u003c\/span\u003e• Advanced True 3D Solder Paste Inspection Technology\u003cbr data-start=\"761\" data-end=\"764\"\u003e• XL Configuration for Large PCB Assemblies\u003cbr data-start=\"807\" data-end=\"810\"\u003e• 4 Megapixel High-Resolution Inspection Camera\u003cbr data-start=\"857\" data-end=\"860\"\u003e• 15 μm Measurement Resolution\u003cbr data-start=\"890\" data-end=\"893\"\u003e• Accurate Solder Volume, Height, Area \u0026amp; Shape Measurement\u003cbr data-start=\"951\" data-end=\"954\"\u003e• Early Print Defect Detection to Improve Yield\u003cbr data-start=\"1001\" data-end=\"1004\"\u003e• Supports High-Mix \u0026amp; High-Volume SMT Production\u003cbr data-start=\"1052\" data-end=\"1055\"\u003e• Optimized for Large Format PCB Manufacturing\u003cbr data-start=\"1101\" data-end=\"1104\"\u003e• Production-Ready Industrial Inspection System\u003c\/p\u003e\n\u003cp data-section-id=\"14caze6\" data-start=\"1158\" data-end=\"1187\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"1161\" data-end=\"1187\"\u003eMachine Specifications\u003cbr\u003e\u003c\/strong\u003e\u003c\/span\u003e• \u003cstrong data-start=\"1190\" data-end=\"1207\"\u003eManufacturer:\u003c\/strong\u003e Koh Young Technology\u003cbr data-start=\"1228\" data-end=\"1231\"\u003e• \u003cstrong data-start=\"1233\" data-end=\"1243\"\u003eModel:\u003c\/strong\u003e KY8030-3 XL\u003cbr data-start=\"1255\" data-end=\"1258\"\u003e• \u003cstrong data-start=\"1260\" data-end=\"1277\"\u003eMachine Type:\u003c\/strong\u003e 3D Solder Paste Inspection (SPI) System\u003cbr data-start=\"1317\" data-end=\"1320\"\u003e• \u003cstrong data-start=\"1322\" data-end=\"1345\"\u003eManufacturing Year:\u003c\/strong\u003e 2019\u003cbr data-start=\"1350\" data-end=\"1353\"\u003e• \u003cstrong data-start=\"1355\" data-end=\"1369\"\u003eCondition:\u003c\/strong\u003e Used\u003c\/p\u003e\n\u003cp data-section-id=\"id1bjs\" data-start=\"1381\" data-end=\"1412\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"1384\" data-end=\"1412\"\u003eTechnical Specifications\u003cbr\u003e\u003c\/strong\u003e\u003c\/span\u003e• \u003cstrong data-start=\"1415\" data-end=\"1441\"\u003eInspection Technology:\u003c\/strong\u003e True 3D Solder Paste Inspection (SPI)\u003cbr data-start=\"1479\" data-end=\"1482\"\u003e• \u003cstrong data-start=\"1484\" data-end=\"1495\"\u003eCamera:\u003c\/strong\u003e 4 Megapixel High-Resolution Camera\u003cbr data-start=\"1530\" data-end=\"1533\"\u003e• \u003cstrong data-start=\"1535\" data-end=\"1562\"\u003eMeasurement Resolution:\u003c\/strong\u003e 15 μm\u003cbr data-start=\"1568\" data-end=\"1571\"\u003e• \u003cstrong data-start=\"1573\" data-end=\"1599\"\u003eInspection Parameters:\u003c\/strong\u003e Solder Volume, Height, Area, Shape \u0026amp; Print Quality\u003cbr data-start=\"1650\" data-end=\"1653\"\u003e• \u003cstrong data-start=\"1655\" data-end=\"1677\"\u003ePCB Configuration:\u003c\/strong\u003e XL (Extra Large PCB Support)\u003cbr data-start=\"1706\" data-end=\"1709\"\u003e• \u003cstrong data-start=\"1711\" data-end=\"1733\"\u003eInspection Method:\u003c\/strong\u003e Non-Contact 3D Optical Measurement\u003cbr data-start=\"1768\" data-end=\"1771\"\u003e• \u003cstrong data-start=\"1773\" data-end=\"1789\"\u003eApplication:\u003c\/strong\u003e Inline SMT Solder Paste Inspection\u003cbr data-start=\"1824\" data-end=\"1827\"\u003e• \u003cstrong data-start=\"1829\" data-end=\"1849\"\u003eProcess Control:\u003c\/strong\u003e Early Print Defect Detection \u0026amp; Process Monitoring\u003c\/p\u003e\n\u003cp data-section-id=\"192mda6\" data-start=\"1906\" data-end=\"1936\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"1909\" data-end=\"1936\"\u003ePhysical Specifications\u003cbr\u003e\u003c\/strong\u003e\u003c\/span\u003e• \u003cstrong data-start=\"1939\" data-end=\"1957\"\u003eConfiguration:\u003c\/strong\u003e XL (Extra Large PCB Handling)\u003cbr data-start=\"1987\" data-end=\"1990\"\u003e• \u003cstrong data-start=\"1992\" data-end=\"2014\"\u003eInstallation Type:\u003c\/strong\u003e Inline SMT Production System\u003c\/p\u003e\n\u003cp data-section-id=\"1v4dold\" data-start=\"2050\" data-end=\"2081\"\u003e\u003cspan role=\"text\"\u003e\u003cstrong data-start=\"2053\" data-end=\"2081\"\u003eCondition \u0026amp; Availability\u003cbr\u003e\u003c\/strong\u003e\u003c\/span\u003e• Used Industrial Equipment\u003cbr data-start=\"2109\" data-end=\"2112\"\u003e• Manufacturing Year: 2019\u003cbr data-start=\"2138\" data-end=\"2141\"\u003e• Large PCB (XL) Configuration\u003cbr data-start=\"2243\" data-end=\"2246\"\u003e• Production-Ready Equipment\u003cbr data-start=\"2274\" data-end=\"2277\"\u003e• Immediate Availability \u003c\/p\u003e","brand":"Koh Young","offers":[{"title":"Default Title","offer_id":45837267009580,"sku":null,"price":0.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0580\/7672\/5292\/files\/SPI_KY8030_3_1.jpg?v=1784752877","url":"https:\/\/lewis-clark.com\/en-ca\/products\/2019-koh-young-ky8030-3-xl-3d-solder-paste-inspection-spi-system","provider":"Lewis \u0026 Clark LLC","version":"1.0","type":"link"}