{"product_id":"2015-universal-instruments-fuzion2-60-dual-beam-platform","title":"2015 Universal Instruments FUZION2-60 Dual Beam Platform","description":"\u003cp\u003eHigh-Speed Dual-Beam SMT Placement Platform for Flexible, Medium-Volume Production\u003c\/p\u003e\n\u003cp class=\"isSelectedEnd\"\u003e\u003cspan\u003eThe \u003c\/span\u003e\u003cstrong\u003e\u003cspan\u003eUniversal Instruments FUZION2-60\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e is a flexible, high-speed dual-beam SMT placement platform designed for medium-volume production, line boosting, and high-performance small-part placement. This 2015 system features dual 30-spindle FZ30™ heads, advanced on-the-head vision, high-speed placement, and compatibility with Universal Gold Feeders. Its configuration may suit chip-shooting and small- to large-component placement applications.\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"isSelectedEnd\"\u003e\u003cspan\u003e📷 Stock Photo — Actual Machine Images Coming Soon.\u003c\/span\u003e\u003c\/p\u003e\n\u003ch3\u003e\u003cspan\u003eKey Specifications\u003c\/span\u003e\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eManufacturer:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e Universal Instruments\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eModel:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e FUZION2-60 Dual Beam Platform\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eYear:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e 2015\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eMachine Software:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e Fuzion 3.13.X\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003ePower Configuration:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e 380–415 VAC, CE\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003ePlacement Heads:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e (2) 30-Spindle FZ30™\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003ePlacement Speed:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e Up to 66,500 CPH; 40,500 CPH (1-Bd IPC Chips)\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003ePlacement Accuracy:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e ±34 µm (Chips); ±34 µm (ICs)\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eMaximum Board Size:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e 508 × 1016 mm\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eFeeder Inputs:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e Up to 136\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eComponent Size Range:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e 008004 (0.25 × 0.125 mm) minimum; up to 30 × 30 × 6 mm maximum\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eFront Head:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e FZ30 Front\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eRear Head:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e FZ30 Rear\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003ePEC Cameras:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e 0.66 MPP Beam 1 \u0026amp; Beam 2 PEC\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eNFOV Cameras:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e 0.55 MPP Front \u0026amp; Rear\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eWFOV Cameras:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e 2.8 MPP Front \u0026amp; Rear\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eFront-Left Nozzle Changer:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e FZ30 HSC 70-Pocket Nozzle Changer\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eRear-Right Nozzle Changer:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e FZ30 HSC 70-Pocket Nozzle Changer\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eBoard Transfer Direction:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e Left-to-Right\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e\u003cspan\u003eFeeder Compatibility:\u003c\/span\u003e\u003c\/strong\u003e\u003cspan\u003e Universal Gold Feeders\u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003e\u003cspan\u003eFeatures\u003c\/span\u003e\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan\u003eFlexible High-Speed SMT Placement\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eDual-Beam Platform Architecture\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eMedium-Volume Production Support\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eLine Booster Capability\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eHigh-Performance Small-Part Placement\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003e(2) 30-Spindle FZ30™ Placement Heads\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eOn-the-Head Vision\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eDual PEC Camera System\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eFront \u0026amp; Rear NFOV Vision\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eFront \u0026amp; Rear WFOV Vision\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eUp to 136 Feeder Inputs\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eHigh-Speed Component Placement\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003e70-Pocket Nozzle Changers\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eUniversal Gold Feeder Compatibility\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eChip-Shooting Applications\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eFlexible PCB Assembly\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan\u003eLeft-to-Right Board Transfer\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Universal Instruments","offers":[{"title":"Default Title","offer_id":46072993546284,"sku":null,"price":0.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0580\/7672\/5292\/files\/2-60new.jpg?v=1788295186","url":"https:\/\/lewis-clark.com\/en-ca\/products\/2015-universal-instruments-fuzion2-60-dual-beam-platform","provider":"Lewis \u0026 Clark LLC","version":"1.0","type":"link"}